Electroless Nickel Plating: Bath Control

Authors:	Kantola Kalle, Helsinki University of Technology, Finland Tenno Robert, Helsinki University of Technology, Finland Koivo Heikki, Helsinki University of Technology, Finland
Topic:	6.1 Chemical Process Control
Session:	Simulation and Control of Advanced Materials Manufacturing Processes
Keywords:	Control, modelling, chemical industry

Abstract

In this paper, bath control is proposed for the electroless nickel plating through holes board process. The main parameters of the product (board) – thickness of the plating film and phosphorous content – are stabilized at constant levels using optimal tracking control. The set point for control is calculated from the model in dependence on the current state of the process. The pH-index and nickel percentage are stabilised at time-variable set points using simple feed-forward PI-control that is robust to the loading perturbation.